From July 19th to 21st, the 2023 China (Beijing) International Audiovisual Integrated Equipment and Technology Exhibition (InfoComm China 2023) was held at the National Convention Center.
As one of the most important display products, LED screens have attracted over 20 exhibitors. In addition to the typical enterprises listed below, companies such as Huanyu Lanbo, TCL Commercial, Hisense Commercial, and Sony also participated.
Through research and analysis of participating companies, RUNTO believes that the main growth momentum of the LED display screen market is reflected in the development of smaller spacing and changes in packaging technology paths. Next is the development of segmented emerging application fields such as all-in-one machines, xR virtual photography, naked eye 3D, transparent screens, cinema displays, and home displays.
Product: The proportion of micro spacing (P<1.0) increased by 7 percentage points to 17%
The application of micro spacing LED products is mainly in the fields of command and monitoring, and video conferencing, which require ultra high definition and more refined display screens. In recent years, with the increasing investment in the construction of Big data visualization platform and the continuous growth of the demand for video conferencing, LED displays have begun to rapidly deepen their development towards smaller spacing.
According to the prediction of RUNTO, in the Chinese Mainland market in 2023, the area share of micro spacing (P<1.0) in the overall pan small spacing market will increase by 7 percentage points to 17%; Products with a spacing range of P2.5 to 1.0 have been reduced to 83%.
Packaging: COB enters an explosive period, and MiP enters its first year of downstream development
The main packaging technologies for small pitch LED displays are SMD (including IMD) and COB. Within the product range with a spacing of P1.0, the advantages of COB technology are more prominent, and the increase in yield leads to cost optimization, resulting in a rapid increase in its market share.
According to RUNTO's forecast data, in 2023, COB products will account for 15% of small pitch LED displays, an increase of 5 percentage points; SMD (including IMD) products account for 85%. In this exhibition, more than half of the companies released and displayed COB products, which means that COB may enter an explosive period.
In addition to SMD and COB technologies, another type of packaging technology path, MiP, also has certain advantages, with more flexible processes and relatively controllable costs. At this exhibition, Liad released the Black Diamond (MiP) series of products; In addition, the packaging factory's Crystal Platform showcases a series of MiP packaging products, including MiP1010, MiP0606, and MiP0404, which can cover point spacing between P0.5 and 1.25. MiP packaging technology began to emerge in 2021 and gradually became popular upstream in 2022; It is expected that 2023 will be the first year of development for MiP downstream products.
In general, from the perspective of coping with the upgrade risk of the future Technology roadmap, COB and MiP will continue to invest, and they will coexist for a long time.