On December 20th, Hong Jinyang, Chairman of Panel Factory Innolux Optoelectronics, stated that at present, 85% of capital expenditures are still concentrated in panel related products and 15% in semiconductor applications. He hopes to increase semiconductor applications year by year and reach a 50-50 ratio in the future.
Qunchuang held a media exchange meeting, and Hong Jinyang pointed out that the panel level fanout packaging technology production line transformed from a 3.5-generation factory was originally scheduled to be shipped by the end of this year, but due to less optimistic customer demand for mobile applications, it will be postponed to next year and other uses will be sought to fill the production capacity; But still optimistic about the fanout packaging technology belonging to semiconductor applications; However, the future expansion of new production lines still needs to be confirmed by customers before the construction of production lines can be carried out.
Hong Jinyang explained that launching fan out packaging technology and transforming into a 3.5-generation panel factory is currently the most appropriate approach. He hopes to help the packaging industry, not replace CoWoS technology, but assist the industry chain in meeting the packaging needs of chips at all levels. In the future, products can even be used as silicon photonics carriers.
He emphasized that although selling the factory to TSMC, profit from selling the factory is definitely not a regular plan.
Yang Zhuxiang, General Manager of Innolux, explained that TSMC's application for US patents ranks first in the world in terms of patent rights, while Innolux ranks second. Currently, they have obtained 282 patents and are expected to exceed 300 patents this year. The fan out packaging technology of crowdsourcing can be applied in fields such as automotive and low orbit satellites.
Yang Zhuxiang explained that fan out packaging technology uses a square substrate, which is different from the current circular structure of semiconductor wafers. Each has its own advantages and disadvantages. The key to mass producing fan out packaging products lies in the attitude of semiconductor leading manufacturers. Once it is determined, market demand will be significantly amplified.
Regarding the ups and downs brought about by the economic cycle in the panel industry in recent years, in addition to transforming into new application areas, Yang Zhuxiang believes that the current environment is like "thick snow covering residual lotus, lotus roots should grow in spring, bloom and bear lotus seeds, and spring will come at the end of the year". He is optimistic about the new year.
Yang Zhuxiang said that he is a 30-year veteran in the panel industry, from cathode ray tubes (CRT) and liquid crystal panels (LCD) with a retired plasma television (PDP) in between, to organic light-emitting diodes (OLED) and micro LEDs, and has also expanded panel level fan out packaging technology.
Hong Jinyang stated that since taking over as chairman in 2018, the first six years have passed. The focus of the first six years will be on stabilizing vitality, striving for profitability, adopting organizational changes, and streamlining organizational structure. In the first stage, there will be some organizational spin offs, such as the spin off of Ruisheng Optoelectronics, which produces X-ray sensors, to find Haikou.
He said that in the second six years, he will break through and transform, expand his reach; The core competitiveness of the second stage mainly lies in the refinement of large-area glass and the development of panel level fanout packaging business. In addition, the automotive department will be separated and directly negotiate with end brand customers to connect with them; But it also led to pressure from system integration factories (SI) to cut orders, so they flew several times to Germany, traveled 1527 kilometers, visited European large car factories, and let customers know that the best innovation solution was to bring them back one by one.
He said that Qunchuang has a total of 580 patents for Micro LED and cooperates with automotive electronics and consumer electronics factories. The validation of Micro LED for automotive use takes time, and it will be first produced on the 3.5-generation low-temperature polycrystalline silicon (LTPS) production line, and will be produced on the 6th generation line in the future.
Hong Jinyang is optimistic about Micro LED in the transparent display and automotive markets. Although Chinese Mainland's electric vehicle market accounts for about half of the world's total, Qunzhuang's electric vehicle customers are in Europe and America, but they will also try to find the Chinese Mainland market.
In addition, Hong Jinyang is optimistic that the silicon photonics industry is a long-term path, and currently only through investing in silicon photonics companies.
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